Sunlam Laminate Adhesives
The SunLam family of solvent free and solvent-based lamination adhesives are designed to meet the needs of all the major flexible packaging applications globally from general performance (snack and confectionary)
12 & 13 Feb 2025
NEC Birmingham
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Are you interested in speaking in front of a packaging audience? If so submit your proposal below!
Click here for general news.
Read all about the press coverage of Packaging Innovation & Empack.
Click and find out why you should be downloading the app ahead of Packaging Innovations & Empack 2024!
Check out our photo gallery from PI&E 2024
Read all about the press coverage of Packaging Innovation & Empack.
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The SunLam family of solvent free and solvent-based lamination adhesives are designed to meet the needs of all the major flexible packaging applications globally from general performance (snack and confectionary)
The SunLam™ range of lamination adhesives are designed to meet the performance and production effeciencies demanded by the flexible packaging market. Our range of conventional and fast curing solventless and
Uncover how flexible packaging is changing the game in the packaging industry. Our infographic dives into how Sun Chemical’s innovative inks, coatings, and lamination adhesives are making packaging more sustainable
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