EU Invests in Semiconductor Pilot Line to Enhance Advanced Packaging Production

The European Union, under its Chips Act programme, has allocated funding to the Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) pilot line project. Coordinated by Fraunhofer, this initiative aims to bolster Europe’s semiconductor manufacturing capabilities by developing reliable packaging solutions, integrating diverse semiconductor materials and technologies, and facilitating chiplet integration. VTT Technical Research Centre of Finland will contribute expertise in radio frequency technologies essential for 6G networks and the advancement of optical microsystems and chip packaging methods. This project is part of a broader effort to strengthen Europe’s position in the global semiconductor market.